Ball-wedge integrated multi-function bonding machine M6000

M6000 multifunctional bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.
M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure control, high bonding accuracy; integrated design of the whole machine, compact structure, good user experience.