CONTACT SOLDERING WITH VACUUM:MUX200

MUX200 Vacuum welding furnace is designed for small batch production and research and development, this machine needs no flux, no empty solder joints, using different gases [up to 100% N2, N2 / H2 95% / 5%], is the ideal equipment for production, it can also be used in formic acid (HCOOH) activation applications, and RF plasma dry activation applications. When using the latter, the solder joints are not empty and unusually clean. Equipment is one of the key equipment in the packaging process after the semiconductor production line.